Company Background

  • Landmark RF Diode dielectric sputtering systems enabling high throughput deposition of thick alumina layers used in Thin Film Heads.
  • Multi-chamber processing on our 602 Series cluster platform to allow multi-layer insitu processing or higher thruput single layer processing.
  • Precise film property control, including exceptional film thickness uniformities.
  • A process development team to help customers optimize process and equipment performances for their specific applications.
  • An expanded Components Product Line resulting from the acquisition of US, Inc. and their popular MAK sputter sources and substrate heaters.
  • A broad range of high-precision vacuum throttle valves.
  • Complex sub-systems designed for customer’s unique requirements, often incorporating MeiVac sputter sources, substrate heaters, etc.

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