Production-proven 24/7 cluster tool
- Fully automated processing of up to 200mm Ø substrates
- Available with 2 to 4 process modules and with 2 load-locks
- Process modules are field retrofittable
- Brooks MX-600 cluster platform with Mag 7 robot
- Every chamber has a dedicated slot valve and pump stack with turbo & water pump.
- Cassette present sensor, wafer present sensors, and wafer slideout sensors
- Aligner with notch detection and orientation
- Wafer temperature sensor
- Integrated RGA for system control
- Optimized for Hard Disk Drive Thin Film Head application
- Al2O3, SiO2, Ta2O5 …
- From 0.2µ to 23µ for Al2O3
- O2 process capable for enhanced side wall coverage
- <1.0% sigma/mean uniformity and layer concentricity§ High rate deposition
processes (>950A/min) - Proprietary, multi-MFC gas distribution system for process modules
- Helium backside gas cooling
- RF substrate bias option to enhance deposited film properties
- Available for metal or reactive dielectric material deposition§ Windows 7
based UI and GE RX3i Programmable Logic Controller (PLC) - Profibus communications to key components on the system
- Configurable SECS/GEM option for communication with most fabs’ Manufacturing Execution Systems (MES)
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