Production-proven 24/7 cluster tool

• Fully automated processing of up to 200mm Ø substrates
• Available with 2 to 4 process modules and with 2 load-locks
  • Process modules are field retrofittable
• Brooks MX-600 cluster platform with Mag 7 robot
• Every chamber has a dedicated slot valve and pump stack with turbo & water pump.
• Cassette present sensor, wafer present sensors, and wafer slideout sensors
• Aligner with notch detection and orientation
• Wafer temperature sensor
• Integrated RGA for system control
• Optimized for Hard Disk Drive Thin Film Head application
  • Al₂O₃, SiO₂, Ta₂O_{5 …}
  • From 0.2µ to 23µ for Al₂O₃
  • O₂ process capable for enhanced side wall coverage
• <1.0% sigma/mean uniformity and layer concentricity§ High rate deposition
  processes (>950A/min)
• Proprietary, multi-MFC gas distribution system for process modules
• Helium backside gas cooling
• RF substrate bias option to enhance deposited film properties
• Available for metal or reactive dielectric material deposition§ Windows 7
  based UI and GE RX3i Programmable Logic Controller (PLC)
• Profibus communications to key components on the system
• Configurable SECS/GEM option for communication with most fabs’ Manufacturing Execution Systems (MES)