Precision 602 Single-Wafer, Cluster Sputtering Tool Family
MeiVac's 602 Series system offers high precision, production-proven sputtering in a high uptime, expandable system platform. The first in this series was the MeiVac 602G, a single process chamber system for the deposition of thinner alumina gap layers. Then, responding to the needs for both higher performance films and higher productivity tools, MeiVac introduced the 602 two and three chamber versions. These systems are ideally suited to applications that require process chamber isolation, chamber-to-chamber substrate transfer in vacuum and/or higher productivity (throughput); concurrently depositing thicker films that meet the tightest film property specifications.
MeiVac 602 systems are automated, load-locked, single substrate deposition tools optimized for alumina layers used in thin film magnetic heads. These systems can also be configured to deposit metals as well as other dielectric materials. The systems deposit in the static, sputter-down mode and can be equipped with a variety of RF or DC sources. The standard Dielectric sputter source is an RF Diode. However Planar Magnetrons are an option for processes that could include reactive deposition.
Today's magnetic recording heads require the deposition of increasingly precise alumina layers. The MeiVac 602 deposition chambers provide superior film properties whether they are for ultra-thin gap layers or thicker basecoat and overcoat layers. Higher productivity for thicker films is realized by equipping process modules with added cooling and operating at power levels that allow deposition rate increase of up to 50% more than those used for thinner gap films. The result is throughput normally associated with the MeiVac 2480 while delivering repeatable, tight tolerance films normally associated with automated, load-locked tools. Uniformities in the 1% - 2% range are routinely achieved in this higher productivity mode.
Control and monitoring of the 602 Series systems are accomplished through a Programmable Logic Controller (PLC) for each process chamber and a Windows® XP based Graphical User Interface (GUI). The advanced point-and-click GUI provides easy access to and control of the system. Multi-level password protection allows different operational access levels while maintaining ease of functional control. Configurable SECS/GEM software is available to interface new or existing tools to most fabs' Manufacturing Execution Systems (MES)
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