Precision 602 Single-Wafer Cluster Tool

Production-proven 24/7 sputtering tool.
Fully automated processing of up to 200mm Ø substrates
Film thickness uniformities typically <0.5% sigma/mean
Helium Backside Gas Cooling keeps substrates typically <100°C
RF Diode or Planar Magnetron sputter source options
Available with multiple process chambers and load-locks
Optimized for Hard Disk Drive Thin Film Head applications
RF substrate bias option to enhance deposited film properties
Available for metal or reactive dielectric material deposition
Programmable Logic Controller (PLC) and Graphical User Interface (GUI) delivers point and click functionality
Configurable SECS/GEM option for communication with most fabs' Manufacturing Execution Systems (MES)
CE certified

+1.408.362.1000