2480 RF Diode Batch Sputter Tool

Production-proven 24/7 sputtering tool.
Semi-automated processing of up to six 150mm Ø or four 200mm Ø substrates per run
20 in. square target with RF Diode sputter source
RF substrate bias option to enhance deposited film properties
Film thickness uniformities typically <1% sigma/mean
Helium Backside Gas Cooling keeps substrates typically <100°C
Optimized for Hard Disk Drive Thin Film Head applications
Production or development ready for MEMS, MRAM and other applications
Programmable Logic Controller (PLC) and Graphical User Interface (GUI) delivers point and click functionality
Configurable SECS/GEM option for communication with most fabs' Manufacturing Execution Systems (MES)
CE certified

+1.408.362.1000