2480 RF Diode Dielectric Sputter Tool
MeiVac developed its family of RF Diode batch dielectric sputtering systems expressly to meet the high throughput requirements of thick alumina deposition in the manufacture of Hard Disk Drive Thin Film Heads. Developed more than 25 years ago, and refined over several generations, these tools have become the industry standards for alumina deposition in Thin Film Head fabrication. With more than 250 installed worldwide, these production proven tools deliver the process repeatability and equipment reliability that customers have come to depend on.
MeiVac is in constant contact with its customers, working closely to optimize existing processes and tool performance as well as assisting in process development efforts necessary for new applications, substrate sizes and formats.
Product Enhancements
MeiVac continually strives to improve product performance and flexibility of its tools. This has led to a steady stream of product enhancements that are available both on new tools as well as retrofits on older models. This approach to tool optimization and longevity has MeiVac systems producing long after lesser tools have been abandoned. Examples of popular enhancements include:
Helium Backside Cooling: High deposition rates in an RF diode system result in heat loads that require substrate cooling to stay below customers' temperature limits. MeiVac has developed a helium backside gas cooling system to replace the liquid metal Indium Gallium (InGa) that was formerly used. Helium is a far more uniform cooling medium, and eliminates InGa which is notoriously difficult to apply, a hazardous material and a clean room contaminant.
Pumping: MeiVac has qualified a number of high vacuum as well as roughing pumps on its systems. We offer standard pumping options. But, we can accommodate most customers' requests for specific pump models.
RF Power Delivery: Advanced RF power supply technology has been integrated into systems to improve performance and meet increasingly stringent safety and RFI emission requirements.
Control Systems: The control system was recently upgraded to Windows® XP. Field upgrades have been developed and are now being installed.
Factory Interface: Configurable SECS/GEM software is available to interface new or existing MeiVac tools to most fabs' Manufacturing Execution Systems (MES).
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