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Production-proven 24/7 cluster tool

  • Fully automated processing of up to 200mm Ø substrates
  • Available with 2 to 4 process modules and with 2 load-locks
    • Process modules are field retrofittable
  • Brooks MX-600 cluster platform with Mag 7 robot
  • Every chamber has a dedicated slot valve and pump stack with turbo & water pump.
  • Cassette present sensor, wafer present sensors, and wafer slideout sensors
  • Aligner with notch detection and orientation
  • Wafer temperature sensor
  • Integrated RGA for system control
  • Optimized for Hard Disk Drive Thin Film Head application
    • Al2O3, SiO2, Ta2O5 …
    • From 0.2µ to 23µ for Al2O3
    • O2 process capable for enhanced side wall coverage
  • <1.0% sigma/mean uniformity and layer concentricity§ High rate deposition
    processes (>950A/min)
  • Proprietary, multi-MFC gas distribution system for process modules
  • Helium backside gas cooling
  • RF substrate bias option to enhance deposited film properties
  • Available for metal or reactive dielectric material deposition§ Windows 7
    based UI and GE RX3i Programmable Logic Controller (PLC)
  • Profibus communications to key components on the system
  • Configurable SECS/GEM option for communication with most fabs’ Manufacturing Execution Systems (MES)
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