602 Single-Wafer System

Precision 602 – single Wafer System
  • Production-proven 24/7 sputtering system
  • Fully automated processing of up to 200mm ∅ substrates
  • Film thickness uniformities typically <0.5% sigma/mean
  • Helium Backside Gas Cooling keeps substrates typically <100&deg;C
  • RF Diode or Planar Magnetron sputter source options
  • Available with multiple process chambers and load-locks
  • Optimized for Hard Disk Drive Thin Film Head applications
  • RF substrate bias option to enhance deposited film properties
  • Available for metal or reactive dielectric material deposition
  • Programmable Logic Controller (PLC) and Graphical User Interface
    (GUI) delivers point and click functionality
  • Configurable SECS/GEM option for communication with most fabs’Manufacturing Execution Systems (MES)
  • CE certified
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