2480 Batch System

2480 RF Diode Batch System
  • Production-proven 24/7 sputtering system
  • Semi-automated processing of up to six 150mm or four 200mm substrates per run
  • 20 in. square target with RF Diode sputter source
  • RF substrate bias option to enhance deposited film properties
  • Film thickness uniformities typically <1% sigma/mean
  • Helium Backside Gas Cooling keeps substrates typically <100°C
  • Optimized for Hard Disk Drive Thin Film Head applications
  • Production or development ready for MEMS, MRAM and other applications
  • Programmable Logic Controller (PLC) and Graphical User Interface (GUI) delivers point and click functionality
  • Configurable SECS/GEM option for communication with most fabs’ Manufacturing Execution Systems (MES)
  • CE certified

602-Single-Wafer-System_07

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